Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing Moffat, T. P. ; Walker, M. ; Chen, P. J. ; Bonevich, J. E. ; Egelhoff, W. F. ; Richter, L. ; Witt, C. ; Aaltonen, T. ; Ritala, M. ; Leskelä, M. ; Josell, D. Abstract Publication: Journal of the Electrochemical Society Pub Date: January 2006 DOI: 10.1149/1.2131826 Bibcode: 2006JElS..153C..37M